Applications of Stacked Microvias in Blind and Buried Vias Technology

Stacked Microvias in Blind and Buried Vias Technology

With trends pointing to further miniaturization and the integration of electronics into almost every aspect of our daily lives, PCB designers are faced with increased demands for power density. To meet these challenges, they need more advanced solutions than traditional vias. This is where stacked microvias come in, allowing them to achieve greater design flexibility and functionality.

Unlike standard blind and buried vias, which are holes drilled through multiple layers of the board, microvias are small, less than 150 micrometers in diameter, and are typically found on only one layer. They can be either blind or buried, with each having its own benefits and applications.

Stacked microvias are a great option for high-density interconnect (HDI) boards, and can be used to reduce signal interference, or electromagnetic interference (EMI). By reducing the size of the connection between circuit layers, they allow more space for signal routing and decrease the potential for radiation. They also have a lower parasitic capacitance than through-holes, which can cause switching noise and other circuit problems. Another advantage is that they help to mitigate EMI by reducing stub length, which can reflect signals back into conductors and attenuate or cancel them.

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Applications of Stacked Microvias in Blind and Buried Vias Technology

The use of stacked microvias can also be beneficial for high-speed circuits. The smaller interconnects offer a shorter signal path, which reduces the chance of crosstalk and EMI. The structure also helps to improve signal integrity by allowing small current loops on critical nets and eliminating the effects of signal reflection.

However, as more and more manufacturers have started using these structures in their designs, the reliability of stacked microvias has been called into question. Several cases of failure have been reported, and the problem is believed to be caused by thermal cycling. This causes the copper to expand and exert high stress on the thin plating used in microvias, which can cause them to fail. These failures are usually seen at the interface between a via and its capture pad, or at the metallurgical junction of two stacked microvias.

Despite these concerns, it is important to remember that microvias have many other advantages. They can be used to reduce cost by lowering the number of drill holes required for a design, as well as the amount of solder needed. They can also be used to route more complex circuits in a shorter space, allowing for more advanced and innovative designs. Finally, they can help to increase the yield of a product by ensuring that all the signals on a circuit are properly connected, avoiding signal interference.

As technology continues to evolve, it is likely that stacked microvias will become even more popular. These structures will allow more components to be placed on a circuit board while providing superior performance and reliability. As such, they are a vital part of the future of electronic design. To learn more about stacked microvias, or to discuss the best options for your next project, contact an experienced manufacturer today. They can provide you with the latest in PCB technology and can help you create a custom solution for your unique needs.

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